Thermal conductive gel is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible and thermally conductive elastomer, which is formed with the shape of the structure. After curing, it is equivalent to the thermal conductive silicone gasket. It mainly meets the requirements of low pressure and high compression modulus. It can realize automatic dispensing production with high efficiency. It has good contact with electronic products, increases effective contact area and reduces contact thermal resistance. It can automatically fill the gap and compress infinitely. It is suitable for heat dissipation modules or electronic components with large thickness variation.