UTP-100 ultra high thermal conductivity thermal pad is a high-performance heat conduction thermal interface material, which is made of imported raw materials. It is used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable it to cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.